Nano Ni Thin Films Microstructure Evolution and Their Electrical Resistance

Abstract

Nano Ni thin films were prepared by thermal evaporation technique, their nanoparticles size controlled via process parameters. Ni thin films were deposited on Si wafers and soft glass sheets. The effects of substrate material and their temperatures during deposition on nanoparticles size and thin films microstructure were studied through AFM surface morphological observations and XRD results respectively. It was found that nanoparticles size increased from 7 to 25 nm with increasing Si substrate temperature during deposition, these affects thin films electrical resistance. It was also found that electrical resistivity decreased with increasing nanoparticles size for Ni thin films deposited on Si wafer, while increased with substrate increasing temperature during deposition.