TY - JOUR ID - TI - EFFECT OF FILL RATIO ON EVAPORATOR WALL TEMPERATURE IN A LOOP THERMOSYPHON USED IN ELECTRONIC COOLING APPLICATIONS AU - Samah Ihsan Adnan AU - Aouf Abdulrahman Ahmad AU - Adnan Adulamir Abdulrasool PY - 2020 VL - 24 IS - 2 SP - 18 EP - 29 JO - Journal of Engineering and Sustainable Development (JEASD) مجلة الهندسة والتنمية المستدامة SN - 25200917 25200925 AB - This;paper;presents;the;effect;of;filling;ratio;on;thermal;performance;of;a;loop;thermosyphon. The experimental setup consists of an evaporator, a condenser, a riser and a downcomer. The dimensions of the loop thermosyphon under consideration were chosen so that they are mostly suitable for use in the cooling of electronic components. Distilled water was used as a working fluid. Experiments were carried out to estimate the performance of the loop thermosyphon for a range of input power from 10 to 100 W. Four fill ratios were considered in the present work, namely; 15%, 25%, 50% and 85%. Results showed that the maximum value of wall temperature in evaporator was 95°C, at 100 W input power and 15% fill ratio. The fill ratio of 50% gave the minimum evaporator wall temperature which was 80°C. Increasing fill ratio tends to decrease the evaporator wall temperature for evaporator.

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