@Article{, title={MODELING and SIMULATION of ELECTROPATING PROCESS نمذجة ومحاكاة عمليات الطلاء الكهروكيمياوي}, author={Dr.Tahseen A.Al-Hattab Dr.Haydar A.Hussain Kadhim K. Kahlol}, journal={Iraqi journal of mechanical and material engineering المجلة العراقية للهندسة الميكانيكية وهندسة المواد}, volume={12}, number={2}, pages={375-388}, year={2012}, abstract={In this study, it is acquainted with the kinetics of the chemical andelectrochemical reactions by modeling and understanding of the essential andsecondary (conjugate) chemical and electrochemical reactions during plating process .In addition , the effects of various conditions on the speed and kinetic of thosereactions is also considered . In order to apply this manner , the mean-field kineticequations and Poisson equation for charged lattice model are adopted using two typesof one-dimensional cells for theoretical part of this study , namely (half and full cell) e/2) . Provided that the cell shouldcontain two identical electrodes of thickness (of size (100) with an applied potential of (10) .A computer program in visualbasic is specially constructed to show the results of this study as it should be .Through this program the concentrations are determined including (metallic atoms,cations, anions, solvents, vacancies and electrons) , the charges distribution andelectrical potential across the sites. the results , during the three periods (10)5,3,1( t) , showed that under potential application across the cell , thedeposition continues for long time then it is suppressed when the anode reaches 5failure limit , and it is observed that the deposition increases with the extension ofspace charges at the cathode , from the other hand , the ionic evolution (cation) willtake a peak shape at the cathode , then it has a certain gradient between anode andcathode. A reversed situation occurs for the anions evolution . At the same time, electric potential distribution across the sites becomes higher resulting in depositionincreasing .

} }