THERMAL MANAGEMENT OF A DIRECT ATTACH CHIP OF A LAPTOP COMPUTER

Abstract

This work presents an analytical and computational investigation of the effect of fins length and fin height at different volumetric flow rate of fan on the performance of heat sink. The facility have been adapted by using ANSYS15 and EES software to study the heat transfer characteristics for cross flows air cooled in single processors (chip) in modern laptop and study the effect of the fins in enhancement in heat transfer phenomena and study all variables which have effect on heat transfer phenomena. We make ten different readings of volumetric flow rate of fan from [0.05to 0.25] m3/s and three different reading of height and length at 21 Was heat load from the chip and we find that volumetric flow rate increases heat transfer coefficient and that will decrease junctions temperature from 55.74oC to 43.95oC as volumetric flow rate increase five times. The theoretical and computational results showed good agreements between them as the junction temperature was decreasing when volumetric flow rate of fan increase and fins length increase as a results for additional surface area which dissipated more heat transfer and the fin effectiveness increasing in a results of increasing of volumetric flow rate of fan and fin height.