Comparative Differential Thermal Analysis of Epoxy Resin blends with Amic Acid-Copper Complexes

Abstract

This work deals with the thermal behaviour of epoxy resin blended with eleven mono-and dibasic maleamic acids and their copper complexes. DTA thermograms of all blands show two distinct exotherms (T2 and T4) at high temperatures if compared with those of epoxy alone. Values of T1 and T4 in copper containing blends are higher than their isomers in mono amic acids, while the inverse was observed in copper-diamic acid blends. The presence of copper in the blend shifts the position of the oxidation exotherm (T4) to relatively higher temperatures.