Studying Properties of SF6 Plasma

Abstract

SF6 plasma properties has studied SF6 gas was used as an etching gas .A home built lab. Scale plasma etching system was employed to generate DC plasma. A current density as a function of etch rate vs. voltage at constant pressure and current density as a function of etch rate vs. pressure at constant voltage without wafer were obtained the topography of etchant Silicon - wafer i.e., anisotropy under cutting and dimension were tested .The results were : increasing the voltage and pressure led to increase the current density .

Keywords

gas SF6